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Double Layer MCPCB

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10 Layer PCB Built On Tg170℃ FR4 With Single-End / Differential Impedance Control
 
  1.1 General description
  This is a type of multilayer PCB built on FR-4 substrate with Tg 170°C for the application of Satellite systems with 10 layer copper. It's 1.6 mm thick with white silkscreen(Taiyo) on green solder mask (Taiyo) and immersion gold on pads. This is also an impedance controlled PCB with 50 ohm single-end impedance and 97 ohm with differential impedance control. The base material is from ITEQ supplying 4 up PCBs per panel. They're fabricated per IPC 6012 Class 2 using supplied Gerber data. Each 25 panels are packed for shipment.
 
  1.2 Features and benifits
  Lead free assemblies with a maximum reflow temperature of 260℃
SMT process is resistant to reflow soldering, resistant to rework.
The signal lines form a constant low impedance to the ground
Strict WIP inspection and monitoring as well as working instruction
UL, ISO14001, TS16949 certified
Hassle-free, one-to-one after-sales service
Delivery on time: >98%
 
  1.3 Application
  Preamplifier, Satellite Dish, GPS Tracking Devices, SAN Storage, AC Drives, GSM Signal Booster, Mobile Broadband Router, Inverter 220V, Memory Module, Automotive dashboards
   
  1.4 Parameter and data sheet
 
Base Material: FR-4 TG170℃, er<5.4.IT-180, ITEQ Supplied
Copper Weight: 1 oz / 0.5 oz mix
Board Thickness: 1.6 mm ±10%
Layer Count: 10 layers
Board Size: 199 x 170mm=4PCS
Solder Mask: Green solder mask | white silkscreen
Surface Finish: Immersion gold
Via: via tented
Warpage: ＜0.75%
Net Weight: 0.12 kg/panel
Impedance control Top layer, 7.0 mil trace 50 ohms single end. Layer 3 signal layer, 4.0/4.0 mil trace-space differential impedance = 91 ohms; 4.0/6.0 mil trace-space differential impedance = 97 ohms.
Acceptable standard IPC-CLASS-II
Lead time for prototype: 10 working days
Shelflife: 6 months
   
 
 

 

 

 
　

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